Publications

  1. Krithika Dhananjay, Prachi Shukla, Vasilis F. Pavlidis, Ayse K. Coskun, and Emre Salman. Monolithic 3D Integrated circuits: Recent Trends and Future Prospects. Accepted to appear in IEEE Transactions on Circuits and Systems II (TCAS II): Express Briefs, 2021.

  2. Prachi Shukla, Sean S. Nemtzow, Vasilis F. Pavlidis, Emre Salman, and Ayse K. Coskun. Temperature-Aware Optimization of Monolithic 3D Deep Neural Network Accelerators. Accepted to appear in Asia and South Pacific Design Automation Conference (ASP-DAC) 2021.

  3. Zihao Yuan, Prachi Shukla, Sofiane Chetoui, Sean Nemtzow, Sherief Reda, and Ayse K. Coskun. PACT: An Extensible Parallel Thermal Simulator for Emerging Integration and Cooling Technologies. Submitted to Transaction of Computer-Aided Design (TCAD), 2021. Github repository: https://github.com/peaclab/PACT

  4. Zihao Yuan, Geoffrey Vaartstra, Prachi Shukla, Zhengmao Lu, Evelyn Wang, Sherief Reda, and Ayse K. Coskun. A Learning-Based Thermal Simulation Framework for Emerging Two-Phase Cooling Technologies. In Proceedings of Design, Automation and Test in Europe (DATE), 2020. Best Paper Nominee. [pdf]

  5. Zihao Yuan, Geoffrey Vaartstra, Prachi Shukla, Sherief Reda, Evelyn Wang, and Ayse K. Coskun. Modeling and Optimization of Chip Cooling with Two-Phase Vapor Chambers. In IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED), pp. 1-6, Jul. 2019. [pdf]

  6. Prachi Shukla, Ayse K. Coskun, Vasilis F. Pavlidis, and Emre Salman. An Overview of Thermal Challenges and Opportunities for Monolithic 3D ICs. In ACM Great Lakes Symposium on VLSI (GLSVLSI), pp. 439-444, May 2019. [pdf]

  7. Zihao Yuan, Geoffrey Vaartstra, Prachi Shukla, Sherief Reda, Evelyn Wang, and Ayse K. Coskun. An EDA Tool for Co-designing High-Performance Processors and Emerging Cooling Technologies”. In Workshop on Open-source EDA Technology (WOSET), 2019.

  8. Zihao Yuan, Geoffrey Vaartstra, Prachi Shukla, Mostafa Said, Sherief Reda, Evelyn Wang, and Ayse K. Coskun. Two-Phase Vapor Chambers with Micropillar Evaporators: A New Approach to Remove Heat from Future High-Performance Chips. In 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), pp. 456-464, May 2019. [pdf]

  9. Prachi Shukla. Ml-IDS: A Machine Learning Approach to Detect Wormhole Attacks in Internet of Things. In IEEE Proceedings of Intelligent Systems Conference (IntelliSys), pp. 234-240, Sep 2017. [pdf]

Posters

  1. Prachi Shukla and Ayse K. Coskun. Managing Thermal Integrity in Monolithic 3D Systems. Accepted to Student Research Forum (SRF) at Asia and South Pacific Design Automation Conference (ASP-DAC), 2021.

  2. Prachi Shukla and Ayse K. Coskun. Modeling next-generation hybrid cooling systems for high-performance processors. Poster presented at Design Automation Conference (DAC) in Richard Newton Young Scholars Program, 2018.

  3. Prachi Shukla and Ayse K. Coskun. Modeling next-generation hybrid cooling systems for high-performance processors. Poster presented at Computing Research Association for Women (CRA-W), 2018.